Category
Platform
Type
Epishine Demonstrates Flexible Indoor Solar Cells for Battery-Free Devices at Embedded World 2026
Epishine showcases thin indoor solar cells designed to power low-energy electronics without disposable batteries.
SEGGER emApps Brings Sandboxed Modular Firmware to Microcontrollers
SEGGER emApps introduces a lightweight sandbox that allows modular applications to run safely inside microcontroller firmware.
Nordic Demonstrates Fuel Gauge 2.0 Battery Monitoring at Embedded World 2026
Nordic shows how Fuel Gauge 2.0 software improves battery monitoring and tracks long-term battery health in connected devices.
DFRobot Demonstrates an AI-Powered Electronic Nose Using Gas Sensors
DFRobot combines MEMS gas sensors, TinyML on ESP32, and a LattePanda Mu SBC to create an electronic nose capable of identifying odors.
Satellite IoT Connectivity using Nordic nRF9151 at Embedded World 2026
Nordic Semiconductor shows how the nRF9151 enables IoT devices to communicate through satellites using non-terrestrial networks.
D-Robotics Introduces the RDK S100 AI Robotics Development Board at Embedded World 2026
The RDK S100 combines CPU, AI accelerator, and real-time MCU cores to power advanced robotics and edge AI applications.
Edge AI with Neuton Models and Axon NPU at Embedded World 2026
Nordic Semicondcutor shows how Neuton models and the Axon NPU enable low-power edge AI on nRF54 devices.
Bluetooth Channel Sounding and Tire Pressure Monitoring Demoed by Silicon Labs at Embedded World 2026
Silicon Labs demonstrates Bluetooth Channel Sounding and wireless tire pressure monitoring using the BG22 platform at Embedded World 2026.
Nordic Demonstrates Bluetooth Channel Sounding with nRF54L15 at Embedded World 2026
Nordic shows how Bluetooth Channel Sounding enables secure distance measurement using the nRF54L15 development kit and Android smartphones.
JetBrains CLion Brings Unified Embedded Development to C, C++, and Rust Projects
JetBrains shows how CLion simplifies embedded C and C++ development with integrated builds, debugging, and AI tools at Embedded World 2026.
ADLINK Shows Customizable Edge AI Drone Kit with Qualcomm Processing at Embedded World 2026
ADLINK demonstrates a Qualcomm-powered drone development kit designed for onboard AI processing and customizable hardware.
Octavo OSD62X Packs a Linux Microprocessor Into a Microcontroller-Sized Module
Octavo’s OSD62X integrates a Linux-capable AM62 processor and memory into a compact System-in-Package for simpler embedded development.
Infineon Demonstrates Radar, AI, and Sensor-Powered Humanoid Robot at Embedded World 2026
Infineon shows how radar, depth cameras, and AI sensors combine to power humanoid robot perception at Embedded World 2026.
Embedded World 2026 - What to Expect
Embedded World 2026 runs from March 10 to 12 at NürnbergMesse in Nuremberg, Germany. Three days. One job. Leave with answers you will use in your next design review.
NVIDIA Jetson Compared: Choosing the Right Edge AI Module
A comparison of NVIDIA Jetson modules, covering power, performance, and use cases to help you choose the right edge AI platform for long-term deployment.
Maker Faire Shenzhen 2025: Tools, Tech, & STEM Innovation
Explore four standout Maker Faire Shenzhen 2025 projects, from KVM tools and wireless coding to open-source IoT hardware and STEM learning kits.
Maker Faire Shenzhen 2025: Standout AI, Robotics, & Sensing
A look at the standout AI, robotics, and sensing projects from Maker Faire Shenzhen 2025, featuring edge AI, smart motion, and open hardware.
Highlights from Maker Faire Shenzhen 2025
Maker Faire Shenzhen 2025 brought 30,000 makers, engineers, and innovators together for two days of hands-on AI, robotics, and hardware exploration.