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1.0 PROJECT OVERVIEW: SYNAPSE BLOCKS

PROJECT STATUS: Advanced Prototyping (PCB Fabrication Pending). TARGET MARKET: Educational Technology (EdTech) focused on Neurodiversity (ADHD, Dyslexia).

1.1 THE TECHNICAL DISRUPTION (WHY ARDUINO FAILS)

The current industry standard (Arduino/Breadboard) introduces a CRITICAL POINT OF FAILURE for students: the Friction of Physical Connection.

• WIRING COMPLEXITY: Loose jumper wires and delicate headers (0.1" pitch) are counter-intuitive and lead to high failure rates.

• FAILURE MODE: This failure breaks the student's Flow State, causing distraction and project abandonment, especially in students with ADHD.

1.2 THE SYNAPSE BLOCKS SOLUTION

We have engineered a ZERO-FRICTION interface based on the following principles:

• MAGNETIC POKA-YOKE: Utilizing 10mm N52 Neodymium Magnets (2mm thick) in an alternating North-South polarity pattern. This physically forces correct connection and eliminates wiring errors.

• MODULARITY: Each block is a discrete functional unit (LED, Button, Sensor) that communicates via a standardized I2C Bus Protocol over the magnetic connectors.

1.3 CORE MICROCONTROLLER SPECIFICATION

The project is built on a RISC-V architecture for maximum cost efficiency and future-proofing.

• MCU: WCH CH32V003F4P6 (TSSOP-20).

• COST METRIC: $0.10 USD per unit. This makes the system scalable and fundamentally cheaper than any comparable ATmega328 (Arduino) solution.

• OPERATING VOLTAGE: 3.3V Logic (Internally regulated from 5V/3V input).

2.1 PCB DESIGN SPECIFICATIONS

The Printed Circuit Board (PCB) is the backbone of the Synapse Blocks system.

• DESIGN PLATFORM: EasyEDA (Industry Standard).

• DIMENSIONS: 40mm (L) x 30mm (W).

• LAYER COUNT: 2-Layer FR-4 (Cost-optimized for mass production).

• THICKNESS: 1.6mm (Industry Standard for robust physical handling).

• MANUFACTURING PARTNER: PCBWay. We have leveraged a Student Sponsorship (Order #251209-035817-147) to waive critical fabrication costs, demonstrating immediate financial resourcefulness.

2.2 THE MAGNETIC INTERFACE (I/O)

The unique physical interface uses custom-aligned magnetic contacts, eliminating unreliable DuPont cables.

• CONNECTION METHOD: Pogo Pins connected via custom-positioned N52 Neodymium Magnets.

• COMMUNICATION: The primary data connection uses the I2C Bus, providing reliable, two-wire communication between stacked blocks (SDA and SCL lines).

• POWER DISTRIBUTION: Power and Ground lines are also routed through the magnetic connection points, simplifying the entire circuit path.

2.3 THE MECHANICAL IMPERATIVE (CRITICAL CHALLENGE)

The 3D printed enclosure is not merely a casing; it is a STRUCTURAL REQUIREMENT for system reliability.

• OUTER DIMENSIONS: 64mm x 32mm x 20mm. This size is specifically chosen for Lego/Duplo compatibility, allowing seamless integration with existing DT department resources.

• Z-AXIS CLEARANCE: This is a HIGH-PRIORITY MECHANICAL CONSTRAINT. The enclosure design must incorporate 3mm to 4mm tall standoffs (pillars) internally. This clearance is mandatory to prevent the protruding solder joints (from through-hole components) on the bottom of the PCB from shorting against the plastic case or external surfaces.

• BOTTLENECK: The inability to manufacture this precise enclosure (due to lack of 3D printer access) is the SINGLE POINT OF FAILURE in the entire project timeline.

3.1 FUNDING STREAM 1: THE HACK CLUB GRANT ($400 USD)

We are actively securing institutional seed funding.

• STATUS: BLOCKED (UNDER MANUAL REVIEW).

• OBSTACLE: Automated identity verification failed due to "Country Mismatch" (UK residency with Hong Kong documentation).

• RESOLUTION STRATEGY: We executed a prompt Manual Appeal to the Hack Club identity team, providing UK Biometric Residence Permit (BRP) and BNO Visa documentation. This appeal is anticipated to clear within 24-48 hours, releasing the $400 USD in critical liquidity.

3.2 FUNDING STREAM 2: OPERATION LIQUIDITY (£149 TARGET)

Due to the time sensitivity of the 3D printer acquisition, we cannot wait for the grant. We have initiated a parallel, high-speed liquidation plan.

• OBJECTIVE: Achieve £149 to purchase the Creality Ender-3 V3 SE (The only printer available for immediate shipment).

• ASSET LIQUIDATION MATRIX:

• HARD CURRENCY (CEX): Nintendo Switch Games (High resale value at CeX for immediate cash transfer). Target: £80.

• SOFT CURRENCY (MARKETPLACE): Nerf Gun Collection. Strategically sold on Facebook Marketplace as a "Christmas Bundle" to maximize emotional purchase value (Note: Avoid CEX as they do not accept these assets). Target: £50.

• EXECUTION RHYTHM: This operation is designed to raise the required capital within 12 hours.

3.3 THE MANUFACTURING BOTTLENECK (TIME CRITICAL)

• NEED: Immediate access to a 3D printer for enclosure prototyping and validation.

• PRIOR PLAN FAILURE: Bambu Lab A1 Mini is backordered until JANUARY 22, 2026. This deadline is unacceptable and will compromise the Founder's Edition shipment.

• IMMEDIATE SOLUTION: Pivot to the Creality Ender-3 V3 SE (£149) based on current UK local stock availability. This requires the immediate success of Operation Liquidity.

4.1 THE DT PEDAGOGY PROBLEM (Teacher Perspective)

The Head of DT needs solutions that increase student engagement, reduce frustration, and secure external funding.

• FRUSTRATION METRIC: Traditional electronics lessons suffer high attrition because students get bogged down in wiring errors (a Physical Design Failure), not code errors (a Logical Design Failure).

• LEO'S SOLUTION: By eliminating the physical friction, Synapse Blocks allows the DT curriculum to focus 100% on design logic, flow control, and spatial reasoning, which are core DT principles.

4.2 THE STRATEGIC RESOURCE REQUEST (THE ASK)

Our ask is a mutually beneficial partnership based on immediate need and future grant collaboration.

Resource Required

Immediate Project Benefit

DT Department Benefit

3D PRINTER ACCESS (Creality/Bambu)

Unlocks the FINAL ASSEMBLY of the core prototypes (Enclosures).

ESTABLISHES A NEW BENCHMARK for student-led project development within the DT workshop.

IOP GRANT APPLICATION (£600)

Secures a reliable, future funding stream for bulk component acquisition.

ACQUIRES £600 IN FUNDING for the department, designated specifically for equipment/materials for the RISC-V Engineering Club.

4.3 IOP GRANT ALIGNMENT (THE FUNDING HOOK)

Our project is not merely eligible for the Institute of Physics (IOP) School Grant; it is a PRIORITY CANDIDATE.

• IOP CRITERIA MATCH: The grant prioritizes projects that engage students who are traditionally underrepresented or face educational barriers in STEM.

• SYNAPSE BLOCKS ALIGNMENT: Our explicit focus on Neurodiversity (ADHD/Dyslexia) makes the application compelling, positioning the DT Department as a leader in Inclusive STEM Education.

5.1 SOFTWARE ARCHITECTURE & DEVELOPMENT ENVIRONMENT

We are preparing the software infrastructure to support the hardware rollout.

• MCU Programming: We will use the open-source PlatformIO framework within VS Code, ensuring toolchain compatibility and professional code management.

• Core Protocol: The system will run custom firmware handling the I2C Master/Slave protocol. Each block acts as a Slave, reporting its state (e.g., button press, LED color) to a designated Master Block (the central CPU/USB interface).

• Debugging: We will leverage the SWD (Single Wire Debug) interface via the PD1 pin on the CH32V003, ensuring efficient firmware iteration and troubleshooting.

5.2 THE CURRENT BOTTLENECK MITIGATION STRATEGY

The inability to acquire the Creality Ender-3 V3 SE due to immediate capital needs is the single largest threat.

RISK FACTOR

CURRENT STATUS

MITIGATION STRATEGY

Capital Shortfall (£149)

Hack Club grant pending review.

Operation Liquidity (CEX/Marketplace asset liquidation) is in progress to serve as Bridge Funding.

Enclosure Production

Zero output.

DT Department Collaboration: Immediate access to the 3D printer for the next 48 hours is required to print the first 5 'Golden Sample' cases for magnet validation.

PCB Delay

PCBWay Order #251209-035817-147 pending.

Immediate CTO Action: Draft and send the professional sponsorship confirmation email to PCBWay to unlock manufacturing within 24 hours.

5.3 TTS INTEGRATION FOR INCLUSIVE EDUCATION

We plan to utilize Text-to-Speech (TTS) as an assistive technology feature for the educational kit.

• Purpose: Provide auditory feedback for code outputs or debugging instructions, which greatly benefits Dyslexic and visually impaired students.

• Platform Target: Linux-based systems (for open-source integrity) and web interfaces (Brave browser) using the high-quality Cantonese (zh-HK) voice profiles (e.g., Google Wavenet) via the Web Speech API.

6.1 THE PROJECT'S LONG-TERM IMPACT (SCALABILITY)

Synapse Blocks is designed to be a scalable, open-source platform that will directly benefit the school's reputation and curriculum for years to come.

• Open Source Model: All PCB files (EasyEDA), 3D print files (STL), and RISC-V source code will be published on Hackster.io.

• Global Exposure: This publication will brand the DT Department as a pioneer in low-cost, inclusive EdTech, attracting potential future partnerships and grants.

• Curriculum Integration: The low unit cost enables the DT department to replace expensive, fragile prototyping boards with a robust, magnetic system that can be deployed across entire Year 9 and 10 classes without major budget strain.

6.2 CONCLUSION: THE EMERGENCY DECISION MATRIX

The entire project is ready for lift-off, pending the Head of DT's decision on Tooling Access.

Decision Point

Risk to Project Timeline

Immediate Action Required

3D Printer Access

HIGH. Prototypes stalled; Christmas delivery deadline missed.

Grant Leo unsupervised access to the DT 3D printer for 48 hours for enclosure validation.

IOP Grant

MEDIUM. Missed opportunity to secure £600 non-departmental funds.

DT Head to approve and submit the Synapse Blocks IOP Grant Proposal this week.

Liquidity

LOW. Project's internal Operation Liquidity is robust and on track for £150 acquisition.

Provide a small seed budget (£50) now to expedite component pre-purchase (e.g., Pogo Pins).

6.3 FINAL CALL TO ACTION (THE DEMAND)

"Head of DT, this is a fully managed, financially engineered project that aligns perfectly with the future of technical education. We need to move NOW to leverage the Christmas sales window and secure the IOP funding."

"Our immediate priority is the 3D printer. Your immediate approval unlocks the entire manufacturing chain."