Technical Overview

The IS42S16160G-6BL-TR is a 256Mb synchronous DRAM component manufactured by ISSI, organized as 16M words by 16 bits. This high-speed memory device operates at 3.3V with a 166MHz clock frequency and utilizes advanced pipeline architecture to achieve efficient data transfer rates. The component is packaged in a compact 54-ball BGA measuring 8mm x 8mm and complies with RoHS environmental standards, supplied in tape and reel packaging for automated assembly processes.

Key Features

High-speed operation supporting clock frequencies of 166MHz, 143MHz, and 200MHz
Fully synchronous design with all signals referenced to positive clock edges
Programmable burst lengths of 1, 2, 4, 8, or full page with sequential or interleave sequencing
CAS latency options of 2 or 3 clocks for timing optimization
Auto Refresh (CBR) and Self Refresh modes for power management
LVTTL interface with single 3.3V ±0.3V power supply requirement
Internal bank architecture for hiding row access and precharge operations

Technical Specifications

The memory array is organized as 4 banks of 4M x 16 bits, providing flexible addressing through 13 row address bits (A0-A12) and 9 column address bits (A0-A8). The device supports burst read/write operations and burst read/single write operations, with capability for random column address access every clock cycle. Refresh management includes 8K refresh cycles distributed across 64ms for commercial and industrial temperature grades, ensuring data integrity while minimizing performance impact.

Performance Characteristics

At the -6 speed grade with CAS latency of 3, the device delivers 166MHz operation with 6ns clock cycle time and 5.4ns access time from clock. The programmable burst termination through burst stop and precharge commands allows for efficient memory control. The automotive-grade variants support extended temperature ranges from -40°C to +105°C, making them suitable for demanding environmental conditions.

Industry Applications

This SDRAM component is engineered for applications requiring high-bandwidth memory performance, including networking equipment, telecommunications systems, industrial automation controllers, automotive infotainment systems, and embedded computing platforms. The compact BGA package and robust temperature ratings make it particularly suitable for space-constrained and thermally challenging environments across commercial, industrial, and automotive sectors.

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